The Latest Research Report published by Global Reports Store on ‘Molded Interconnect Devices (MID) Industry Forecast 2019-2025’. Which contains 120 Pages, 80 Figures, and Tables, With a detailed description of past, present, and future of Molded Interconnect Devices (MID) Industry along with 15 Companies detailed profile analysis. Global Molded Interconnect Devices (MID) Industry to reach USD 2480.2 billion by 2025.
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Global Molded Interconnect Devices (MID) Industry valued approximately USD 679.1 billion in 2016 is anticipated to grow with a healthy growth rate of more than 15.48% over the forecast period 2019-2025. Recent technological improvements in telecommunication and consumer applications. Increasing the use of smartphones and the trend of using smart wearable devices are the major factors driving the growth of the Global Molded Interconnect Devices (MID) Industry. This device is connected to various internal parts like circuit boards, and cables, improving the circuitry and eliminating the need for different combinations of components in the PCB circuits. Molded Interconnect Devices (MID) technology enables diminishment in the size of the devices including smartphones and automotive light fixtures, it also reduces assembly time and space-saving circuitry. Unlike traditional PCB circuits, MID facilitates fewer parts required for assembly, aiding to the growth of the Industry. However, lack of widespread implementation, low awareness, and requirement of expertise for manufacturing, low number of vendors offering MID products are the major restraints to the Industry. A molded interconnect device (MID) is a molded thermoplastic part having integrated electronic circuit traces. High-temperature efficient thermoplastics and their structured metallization opens a new dimension of circuit designing to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part by selective metallization. The advantages of MID include, design flexibility, high product reliability and reduces the requirement of auxiliary parts, these devices are Eco-friendly and recyclable, the environmental benefits of the technology include the elimination of hazardous flame-retardant manufacturing process.
The regional analysis of the Global Molded Interconnect Devices (MID) Industry is considered for the key regions such as Asia Pacific, North America, Europe, Latin America and the Rest of the World. North America is the leading/significant region across the world in terms of the Industry share. Whereas, owing to countries such as China, Japan, and India, the Asia Pacific region is anticipated to exhibit a higher growth rate / CAGR over the forecast period 2019-2025.
Player in ‘Molded Interconnect Devices (MID) Industry’:
KF Laser & Electronics
Arlington Plating Company
Suzhou Cicor Technology Co. Ltd
Multiple Dimensions LLC
Laser Direct Structuring
Antennae and Connectivity Modules
Connectors and Switches
North America (USA, Canada)
Europe (Germany, U.K., France, Italy, Rest of Europe)
APAC (China, India, Japan, Rest of Asia-Pacific)
RoW (Latin America, Middle East & Africa)
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High lite Form This Research Report:
1 Business Overview: An exhaustive description of the companies operation and business divisions.
2 Corporate Strategy: Analyst’s summarisation of the companies business strategy.
3 SWOT Analysis: A detailed analysis of company Strength, Weakness, Opportunity, and Threats.
4 Company History: Progression of key events associated with the company.
5 Major Products and Services: A list of major Products, Services, and Brands of the company.
6 Key Competitors: A list of key competitors to the company.
7 Important Locations and subsidiaries: a list and contact details of key locations and subsidiaries of the company.
Table of Contents – Major Key Points
Chapter 1: Executive summary
Chapter 2: Scope of the report
Chapter 3: Market research methodology
Chapter 4: Introduction
Chapter 5: Market landscape
Chapter 6: Market segmentation by product
Chapter 7: Key leading countries
Chapter 8: Market drivers
Chapter 9: Impact of drivers
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